Process： SMIC 65nm

Features： A5 CPU + Secure CPU
DDR4
Cryptographic algorithms
CI+1.4 standard

Die-Size： 5mm*5mm

Application： CAM

Process： UMV 55nm eFlash

Features： Cortex-M4 CPU
Multi power domains
Ultralow power consumption
64 ADC Channels

Die Size： 3mm*3mm

Application： Touch sensor, Analog signal acquisition and processing

Process： SMIC 40nm

Features： Cortex-M4 CPU
Cryptographic algorithms
Fingerprint algorithm
Audio processing
BLE/SPI/I2C/UART/USB/I2S

Die Size： 3mm*3mm

Application： IoT,Smart door lock

Process： TSMC 12nm

Features： Multi-Processor RISC-V
AI PE
DDR4
PCIE 3.0
16 Gbps SerDes
1000M Ethernet

Die Size： 3mm * 3mm

Application： High performance AI image processing